Electronics components distributor

TEL:+1 626 464 6754

Testing Capabilities
External Visual Inspection
Outer packaging inspection
Measurement

Inner packaging inspection

Documentation verification
X-Ray

Verify no voids have formed


Confirm leads and bond wires


Compare OEM parts to X-ray images

Digital Microscopy
Capture any area in complete focus

View with extremely high depth-of-field and

Digital Microscopy

External Visual Inspection


Digital Imagery

Dimensional Measurement


Nondestructive Testing
X-Ray

Data sheet Verification

Marking Permanency Testing

Visual Inspection Capabilities
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DECAPSULATION MACHINE
Verify die size and manufacturers’ logos

Confirm part numbers

Inspect architecture of the die

Copper protection
HEATED SOLVENT TESTING
Identify blacktopping

Detect sand marks and texture differences

Expose signs of counterfeiting
SOLDERABILITY TEST SYSTEM
Verify solderability of component leads

Determine coating durability

Check usability of aged product (corrosion/oxidation)

Decapsulation


Decapsulation is used to verify diesize and manufacturers’ logos, inspect the architecture of thedie, and confirm part numbers.


Heated Solvent

Heated-solvent testing exposessigns of counterfeiting by detecting sand marks, texture differences,and blacktopping.


Solderability Test


Verifies the solderability of componentleads to determine coating durability and checks for signsof corrosion and oxidation on aged products to establish usability.

Additional authenticity testing is availableupon request and can be tailored to fit our customers’ specific requirements.
Destructive Testing Capabilities
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